Pcb-new - پارس پرداز

Advanced PCB

Standard PCB

FPC Rigid-Flex

PCB Specification Selection

Board type :

Single pieces Panel by Customer Panel by ParsPardaz

Panel requirements:

Break-away rail: Yes No

(e.g. Panel in 2*3, size of the break-away rail, total 5 panels=total 30 individual boards)

Route Process:

Panel as ParsPardaz prefer

Panel as ParsPardaz prefer
Panel as V-Scoring
Panel as Tab Route
Both V-Scoring&Tab-routing

X-out Allowance in Panel : Accept Not Accept

Different Design
in Panel :

1 2 3 4 5 6 e.g.

* Size (single):

inch'↔mm

* Quantity (single):

pcs

5
10
15
20
25
30
40
50
75
100
125
150
200
250
300
350
400
450
500
600
700
800
900
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
6500
7000
7500
8000
9000
10000

Other：
(≥5 ㎡ to manually enter the number!)

Layers:

1 Layer 2 Layers 4 Layers 6 Layers 8 Layers 10 Layers 12 Layers 14 Layers

Copper layer:

--
Top layer
Bottom layer
None

Soldermask:

--
Top side
Bottom side
Both sides
None

Silkscreen Legend:

--
Top side
Bottom side
Both sides
None

Material:

FR-4

Aluminum

Rogers

HDI(Buried/blind vias) ≥4 Layers

Copper Base

*Material model can be remarked below. HDI is available for 4-layer or more.

*The base material of 2-layer PCB is automatically upgraded to TG150 for FREE with more stable and higher quality.
Except for some parameters (eg.: Weighty finished copper; Greater board thickness; Custom stackup; Via in pad/ Via filled with resin, etc.)

*Base material with high TG has good CAF resistance, high heat resistance, dimensional stability and is suitable for lead-free soldering process. [Download Material Report]

Thickness:

0.2 0.4 0.6 0.8 1.0 1.2 1.6 2.0 2.4 2.6 2.8 3.0 3.2
≥1.7-6.0 * Unit: mm

Thickness:

0.203 0.305 0.406 0.508 0.813 1.524 * Unit: mm

Thickness:

0.101 0.168 0.254 0.338 0.422 0.508 0.762 1.524 * Unit: mm

Min Track/Spacing:

3/3mil 4/4mil 5/5mil 6/6mil 8/8mil ↑

Min Hole Size:

0.15mm 0.2mm 0.25mm 0.3mm ↑ 0.8mm ↑ 1.0mm ↑ No Drill

Solder Mask:

Green Red Yellow Blue White Black
Purple Matte black Matte green None

Silkscreen:

White Black None

Edge connector:

Yes No Bevelling:

No
Yes (20°)
Yes (30°)
Yes (45°)

HASL with lead HASL lead free Immersion gold(ENIG) OSP Hard gold Immersion silver(Ag) ENEPIG None(Plain copper)

*The above options are only Edge connector Surface Finish

Thickness of
Immersion Gold:

1U" 2U" 3U"

Au/Ni thickness:

Au:10U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Surface Finish:

HASL with lead HASL lead free Immersion gold(ENIG) OSP Hard gold Immersion silver(Ag) ENEPIG None(Plain copper)

Tick means you accept we might change "HASL" to "ENIG" at our discretion without extra charge.

Thickness of
ENEPIG:

Ni:200U" Pd:2U" Au:2U"

Please choose other options of Au/Pd thickness here

Au/Ni thickness:

Au:5U"/Ni:120U"

Please choose other options of Gold /Nickel thickness here

Thickness of
Immersion Gold:

1U" 2U" 3U"

Via Process :

Tenting vias Plugged vias Vias not covered

*For Gerber files, this choice is useless.It will be made according to files as default.

Finished Copper:

Bare board(0 oz Cu) 1 oz Cu 2 oz Cu 3 oz Cu 4 oz Cu 5 oz Cu 6 oz Cu 7 oz Cu
8 oz Cu 9 oz Cu 10 oz Cu 11 oz Cu 12 oz Cu 13 oz Cu

*Min Track/Spacing ≥ 8/8mil, 3 - 13oz Cu opitions will be available.

Inner Copper:

1 oz 1.5 oz 2 oz 3 oz 4 oz 5 oz 6 oz

Extra pcb
product number :

Not to add extra pcb product number on board (extra+$3)

Additional Options (Castellated holes,Edge Plating,impedance control...) More

We may add extra cost for these special options which will be confirmed after review.

Peelable Soldermask:

None
Top side
Bottom side
Both sides

UL Marking:

None
Yes - add to top silkscreen
Yes - add to bottom silkscreen
Yes - add to top soldermask
Yes - add to bottom soldermask
Yes - add to top copper
Yes - add to bottom copper
Yes - as ParsPardaz default

Half-cut/Castellated Holes
Edge Plating
Impedance control
Halogen-Free
Custom Stackup
Carbon Mask
Via in pad/ Via filled with resin
Press-fit holes
Countersinks/Counterbores
Z-axis milling
Black FR4 (black core)

Other Special request:

+ Add PO No.

+ Add File.

PCB Detail List

Material: Tg140 FR-4

FR4-TG

Thermal conductivity

Rogers

Board type: Single pieces

Layers: ۲ Layers

Size: ۱۰×۱۰ mm

Quantity: ۲(single)

Thickness: ۱٫۶ mm

Min Track/Spacing: ۸/۸mil ↑

Min Hole Size: ۰٫۳mm ↑

Solder Mask: Green

Silkscreen: White

Edge connector: No,Bevelling:No,Hard gold,Au:10U”/Ni:120U”

Surface Finish: Immersion gold(ENIG); ۲U”

Finished Copper: ۱ oz Cu

Inner Copper

Additional Options

Final Inspection Report(free)

PCB Specification Selection

Board type :

Panel requirements:

Route Process:

Different Design in Panel :

* Size (single):

* Quantity (single):

Layers:

Copper layer:

Material:

Rogers:

Thermal conductivity:

Structure of MCPCB:

FR4-TG:

Thickness:

Thickness:

Thickness:

Min Track/Spacing:

Min Hole Size:

Solder Mask:

Silkscreen:

Edge connector:

Thickness of Immersion Gold:

Au/Ni thickness:

Thickness of ENEPIG:

Surface Finish:

Thickness of ENEPIG:

Au/Ni thickness:

Thickness of Immersion Gold:

Via Process :

Finished Copper:

Inner Copper:

Extra pcb product number :

Peelable Soldermask:

Other Special request:

PCB Detail List

Different Design
in Panel :

Thickness of
Immersion Gold:

Thickness of
ENEPIG:

Thickness of
ENEPIG:

Thickness of
Immersion Gold:

Extra pcb
product number :